Natural convection in electronic enclosures is studied byperforming three-dimensional numerical simulations. The effect of heatdissipation rate in the enclosure, material properties of enclosurewalls and interboard spacing on heat transfer and flow field in theenclosure is illustrated by temperature contours, velocity contour andvector diagrams. Heat dissipation rate has strong impact on heattransfer and flow field in the enclosure. Nusselt numbers are computedthat can be used in simple conduction type analysis of boards for suchsystems
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