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首页> 外文会议>Electronic Components and Technology Conference, 1995. Proceedings., 45th >Reliability and analytical evaluations of no-clean flip-chipassembly
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Reliability and analytical evaluations of no-clean flip-chipassembly

机译：免清洗倒装芯片的可靠性和分析评估部件

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A process has been developed, qualified and implemented to replacetraditional flip-chip (C4-Controlled Collapse Chip Connection) joiningon ceramic carriers with a new no-clean technique. This importanttechnical achievement overcomes existing cleaning limitations onattaching flip-chip C4's at high melt soldering conditions. Previousno-clean assembly was limited to Direct Chip Attach (DCA) on organicsubstrates at low reflow eutectic (<300° C) solderingtemperatures. Significant cost and environmental benefits have beenrealized with this process simplification. The new method uses a mildfluxing material and reducing atmosphere for flip-chip assembly. It is atremendous advancement for mounting flip-chip C4's with high leadcontent to corresponding copper pads at high reflow (>300° C)temperatures. The no-clean process enabled removal of cleaning stepswhich increased manufacturing efficiency and greatly reduced productcost. Also, elimination of chlorinated cleaning solvents hasaccomplished government mandated reductions on their usage. Assembly,analytical and reliability characterization has been performed tosupport this important development in flip-chip joining. These studieshave provided a comprehensive understanding of process parameters,controls, reaction and yields while assessing component reliability.This thorough evaluation of no-clean assembly processing was critical tosuccessful implementation of the breakthrough accomplishment
机译：已经开发了一个过程，合格和实施以取代 传统倒装芯片（C4控制的塌陷芯片连接）加入 在具有新的无清洁技术的陶瓷载体上。这是重要的 技术成果克服了现有的清洁限制 在高熔体焊接条件下安装倒装芯片C4。以前的 无清洁组件仅限于有机上的直接芯片附着（DCA） 低回流共晶（<300°C）焊接的基材 温度。已经大量成本和环境效益 用这个过程简化实现。新方法使用轻度 芯片材料和减少倒装芯片组件的气氛。它是一个 用高铅安装倒装芯片C4的巨大进步 高回流（> 300°C）的相应铜焊盘内容 温度。无清洁过程能够删除清洁步骤 增加了制造效率和大大降低产品 成本。此外，消除氯化清洁溶剂具有 完成的政府要求减少其使用情况。部件， 已经执行了分析和可靠性表征 在倒装芯片加入中支持这一重要发展。这些研究 提供了对过程参数的全面了解， 在评估组件可靠性的同时控制，反应和产量。 这种无清洁组装处理的彻底评估对于 成功实施突破性成就

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