New applications of photonic interconnects will involve theinsertion of parallel-channel links into Multi-Chip Modules (MCMs). Suchapplications will drive photonic link components into more compact formsthat consume far less power than traditional telecommunication datalinks. MCM-based applications will also require simplified drivecircuitry, lower cost, and higher reliability than has been demonstratedcurrently in photonic and optoelectronic technologies. The workdescribed is a parallel link array, designed for vertical (Z-Axis)interconnection of the layers in a MCM-based signal processor stack,operating at a data rate of 100 Mb/s. This interconnect is based uponhigh-efficiency VCSELs, HBT photoreceivers, integrated micro-optics, andMCM-compatible packaging techniques
展开▼
