首页> 外文会议>Electronic Components and Technology Conference, 1995. Proceedings., 45th >Simulation and modeling of mode conversion at vias in multilayerinterconnections
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Simulation and modeling of mode conversion at vias in multilayerinterconnections

机译:多层通孔中模式转换的仿真和建模相互联系

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The process of signal flow at vias in multilayer interconnectionsis discussed as a general phenomenon involving partial conversion ofsignal-line waveguide mode energy into parallel-plate waveguide modeenergy. This partial conversion of linearly propagating mode into acylindrically propagating parallel-plate waveguide mode at vias isdiscussed and illustrated with the graphic results of a 3D, full-wavepropagation analysis. Based on these observations, equivalent circuitsof vias which incorporate the mode conversion phenomenon are proposed.The effectiveness of the proposed model is demonstrated as a comparisonbetween the 3D, full-wave simulation and SPICE circuit simulation
机译:多层互连中通孔处的信号流动过程 被讨论为涉及部分转化的一般现象 信号线波导模式能量转换为平行板波导模式 活力。将线性传播模式部分转换为 在通孔处的圆柱传播平行板波导模式为 通过3D全波图形结果进行讨论和说明 传播分析。基于这些观察,等效电路 提出了包含模式转换现象的通孔。 通过比较证明了所提出模型的有效性 在3D,全波仿真和SPICE电路仿真之间

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