S-pad implementation; total plastic package crack solution fornon-moisture sensitive package

机译：S-pad的实现;全塑料包装裂纹解决方案非湿敏包装

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This paper investigates capability of following technologies; moldcompound, die attach adhesive, textured die pad, and buffer coat, inresolving or improving the package crack performance of plastic packageduring reflow soldering process. We have finally succeeded in resolvingthis problem by making a die pad smaller than chip size and analyzed thestress, thermal and electrical characterization by using the simulationto determine suitable scoop size and lead frame line-up. The chip sizelimitation was confirmed by actual experiments for a chip size, apackage size and a package thickness

机译：本文调查了以下技术的能力;模子化合物，模具连接粘合剂，纹理模具垫和缓冲涂层，在解决或改善塑料包装的包装裂纹性能在回流焊接过程中。我们终于成功解决了通过使芯片垫小于芯片尺寸并分析的问题来解决这个问题使用模拟应力，热和电气表征确定合适的勺子尺寸和引线框架线。芯片尺寸通过实际实验证实了芯片尺寸的实验，a 封装尺寸和包装厚度

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《Electronic Components and Technology Conference, 1995. Proceedings., 45th》||p.470-477|共8页
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Umehara N.; Inomata S.; Umeda Y.; Naeshiru M.; Sakamoto K.;
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S-pad implementation; total plastic package crack solution fornon-moisture sensitive package

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