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Shaping circuit environment to face the thermal challenge Innovative technologies from low to high power electronics

机译：塑造电路环境以应对热挑战从低功率电子技术到大功率电子技术的创新技术

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This paper describes evolutions of circuit environment to face an ever-increasing thermal challenge, from early design stage down to the final package. To illustrate this critical concern we give a portrayal of innovative technologies and concepts studied for efficient thermal management from low to high power electronics, with an emphasis on hot spot management.

机译：本文描述了从早期设计阶段到最终封装，电路环境在不断发展的热挑战中所面临的演变。为了说明这一关键问题，我们描述了为有效地管理从低功率到高功率电子设备而研究的创新技术和概念，重点是热点管理。

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《IEEE Symposium on VLSI Technology》|2018年|15-16|共2页
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P. Coudrain; J.-P. Colonna; L.-M. Collin; R. Prieto; L.G. Fréchette; J. Barrau; G. Savelli; P. Vivet; Q. Struss; J. Widiez; K. Vladimirova; K. Triantopoulos; H. Beckrich-Ros; M. Vilarrubí; G. Laguna; H. Azarkish; M. Shirazi; J. Michailos;
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Heating systems; Cooling; Thermal management; Three-dimensional displays; Silicon; Bonding; Microchannels;

机译：加热系统;冷却;热管理;三维显示器;硅;键合;微通道;

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4. Shaping circuit environment to face the thermal challenge Innovative technologies from low to high power electronics [C] . P. Coudrain, J.-P. Colonna, L.-M. Collin, IEEE Symposium on VLSI Technology . 2018

机译：塑造电路环境，面对从低到高电源电子的热挑战挑战技术
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Shaping circuit environment to face the thermal challenge Innovative technologies from low to high power electronics

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