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首页> 外文会议>Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems >Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint
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Micro Indentation Measurements of the Creep Properties of CABGA Doped Solder Joint

机译：Cabga掺杂焊点蠕变性能的微压痕测量

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摘要

Doping SAC solder joints with some elements such as Bi (bismuth) and In (Indium) has been found to improve the thermal cycling reliability, reduce the effect of aging, and improve fatigue resistance. However, the impact of such elements on creep and mechanical properties is not well understood. In this study, the creep properties of doped solder joints and the impact on reliability are investigated. Three different lead-free solder alloy compositions are considered, including SAC305, SnAgCu-3Bi, SnAgCu-0.5Bi-6In, SnAgCu-0.5Bi-0.13In, and those were compared with Sn63Pb37 solder alloy. The test vehicle involves three 15mm Ball Grid Array (CABGA) components. Two groups of CABGA are studied. The first group is tested directly after assembly. The second group is thermally cycled between -40oC to +125oC. The Instron 5948 Micro Tester is used to perform the micro-indentation for individual solder joints by using a customized experimental setup with a cylindrical flat indenter. The test conditions involve applying constant load for an extended time and record the indentation depth with time. Three different loads are applied, with 3 replicates each. The test was conducted at room temperature. The results showed that the creep rate of doped alloys was notably lower than SAC305 due to the solid solution hardening of the Sn lattice structure. SAC-3Bi alloys showed improved steady-state creep rate after thermal cycling.
机译：已经发现掺杂囊焊接与一些元素如Bi（铋）和（铟）等元素提高了热循环可靠性，​​降低了老化的效果，提高了疲劳性。然而，这些元素对蠕变和机械性能的影响并不能理解。在该研究中，研究了掺杂焊点的蠕变性能和对可靠性的影响。考虑了三种不同的无铅焊料合金组合物，包括SAC305，SnAGCu-3Bi，SnAGCU-0.5bi-6in，SnAGCu-0.5bi-0.13in，与Sn63Pb37焊料合金进行比较。测试车辆涉及三个15mm球栅阵列（CABGA）组件。研究了两组CABGA。第一组在装配后直接测试。第二组在-40之间热循环c至+125C. Instron 5948微型测试仪通过使用具有圆柱形扁平压痕的定制实验装置来对各个焊点进行微压痕。测试条件涉及延长时间应用恒定负载并随时间记录压痕深度。应用了三种不同的负载，每次3次复制。测试在室温下进行。结果表明，由于Sn格子结构的固溶硬化，掺杂合金的蠕变率明显低于SAC305。 SAC-3BI合金在热循环后显示出改善的稳态蠕变速率。

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