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Identifying Plastic Encapsulant Materials by Pyrolysis Infrared Spectrophotometry

机译:通过热解红外分光光度法识别塑料密封剂材料

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Most semiconductor devices are sealed in plastic. Virtually all plastic encapsulated microcircuits (PEMs) look alike. The particular electronic molding compound (EMC) used to encapsulate a device cannot be known except from production records or firsthand knowledge of people familiar with the device. For a variety of reasons, an EMC may need to be explicitly identified. Pyrolysis of the EMC, followed by Fourier Transform Infrared (FT-IR) chemical analysis of the condensates of organic substances evolved by the pyrolysis, and comparison of the spectra with a reference library of known EMCs, provides a rapid means of specific EMC identification.
机译:大多数半导体器件都密封在塑料中。几乎所有塑料封装的微电路(PEMS)看起来都是相似的。除了从熟悉该设备的人们的生产记录或第一手知识之外,用于封装器件的特定电子模塑化合物(EMC)不能知道。由于各种原因,可能需要明确识别EMC。 EMC的热解,随后是通过热解演化的有机物质的缩合物的傅立叶变换红外(FT-IR)化学分析,以及通过已知EMC的参考文库的光谱比较提供了特定EMC鉴定的快速手段。

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