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Study of a controlled thermally degradable epoxy resin system for electronic packaging

机译：一种用于电子包装的可控热可降解环氧树脂系统的研究

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In flip-chip technology, the reworkable underfill material development has been one of the keys to the recovery of highly integrated and expensive board assembly designs by replacing defected chips. This paper reports the synthesis, formulation and characterizations of two new diepoxides, one contains secondary and the other contains tertiary ester linkages that are thermally degradable below 300 °C. The secondary and the tertiary ester diepoxides were synthesized in three and two steps, respectively. Both compounds were characterized with NMR and FT-IR spectroscopies, and formulated into underfill materials with an anhydride as hardener and an imidazole as catalyst. A dual-epoxy system was also formulated containing the tertiary ester diepoxide and a conventional aliphatic diepoxide, ERL-422lE, with the same hardener and catalyst. The curing kinetics of the formulas was studied with differential scanning calorimetry (DSC). Thermal properties of cured samples were characterized with DSC, thermogravimetric analysis (TGA) and Thermomechanical analysis (TMA). The dual-epoxy system showed a viscosity of 18.7, and 0.87 Poise at 25°C and 100°C, respectively. The cured secondary, tertiary and dual-epoxy formulas showed decomposition temperatures around 265°C, 190°C and 220°C, glass transition temperatures (Tg) around 120-140°C, 110-157°Cand 140-157°C, and CTE of 70 ppm/°C, 72 ppm/°Cand 64 ppm/°C below their Tg, respectively. The shear strength of the cured dual-epoxy system decreased quickly upon being aged at 230°C. The reworkability test showed that the removal from the board of a chip underfilled with this material was quite easy, and the residue on the board could be thoroughly removed with a mechanical brush without obvious damage of the solder mask. In summary, the synthesized tertiary epoxide can be used as a reworkable underfill for flip-chip application.
机译：在倒装芯片技术中，可再加工的底部填充材料的开发一直是关键之一的恢复高度集成的和昂贵的板组件通过更换缺陷芯片设计。本文报道的合成，制剂和两个新的二环氧化物的表征，一个含有仲和另一个包含叔酯键是低于300℃下热降解的。二次和叔酯的二环氧化物在三个和两个步骤分别合成。两种化合物进行了表征NMR和FT-IR光谱，并配制成与酸酐作为硬化剂和咪唑作为催化剂的底部填充材料。一种双环氧系统也配制成含有叔酯二环氧化物和常规脂族二环氧化物，ERL-422lE，用相同的固化剂和催化剂。式的固化动力学，差示扫描量热法（DSC）进行了研究。固化样品的热性能进行了表征与DSC，热重分析（TGA）和热力学分析（TMA）。双环氧体系显示出粘度为18.7，和0.87泊，在25℃和100℃，分别。固化的二级，三级和双环氧公式表明周围265℃，190℃和220℃，玻璃化转变温度（Tg）左右120-140℃，110-157℃与140-157℃的分解温度，和70ppm的的CTE /℃，72 PPM /℃与64 ppm的/°低于它们的Tg C，分别。当在老化在230℃下固化的双环氧体系的剪切强度迅速下降。再加工试验表明，从用这种材料底部填充的芯片的电路板中除去是相当容易的，并在板上的残余物可以与没有焊料掩模的明显的损伤的机械刷彻底除去。总之，合成叔环氧化物可以作为倒装芯片应用中的返修，。

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