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HEAT PIPE PERFORMANCE ENHANCEMENT FOR MICROELECTRONICS COOLING

机译:微电子冷却的热管性能增强

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The heat dissipated by convection from the fins of the heat pipe condenser section is strongly limited by the thermal barrier of the oxide layer formed on their aluminum surface. A lot of work has been done to enhance the heat transfer coefficient of this heat pipe section by changing the fins roughness. The present experimental study demonstrates the enhancement in heat transfer coefficient by applying a more conductive coating on the condenser fins surface. A comparison between a conventional technique consisting of applying a rougher surface and this new technique is performed. Results clearly show the performance of the heat pipe exhibits a better enhancement in the case of a more conductive coating than a rougher one. The orientation of the heat pipe is also investigated to demonstrate the effect of gravity on the enhancement so observed. Hydrodynamics inside the heat pipe is considered to explain the findings.
机译:通过从热管冷凝器部分的翅片的对流消散的热量受到在其铝表面上形成的氧化物层的热屏障的强烈限制。已经完成了许多工作来通过改变翅片粗糙度来提高该热管部分的传热系数。本实验研究通过在冷凝器翅片表面上施加更多导电涂层来证明传热系数的增强。执行由施加更粗糙的表面和这种新技术的传统技术之间的比较。结果清楚地显示出热管的性能在比粗糙的涂层的情况下表现出更好的增强。还研究了热管的取向,以证明重力对如此观察到的增强的影响。热管内的流体动力学被认为是解释调查结果。

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