Fine Pitch Metal Deposition on LDS Materials

机译：LDS材料上的细间距金属沉积

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Moulded Interconnect Devices (MID) enable versatile applications with 3D circuitry on 3D shaped injection moulded thermoplastic parts. Especially laser based patterning technology combined with selective metallization shows high capability for various miniaturized applications. With a minimized spot size, the laser system in the so-called LPKF-LDS process is a fine patterning tool and is very flexible concerning the 3D circuitry by simple adapting the laser processing parameters. In this paper a new process for fine pitch metal deposition on a new liquid crystal polymer material for Laser Direct Structuring (LDS LCP) is described.

机译：模压互连器件（中间）使3D电路在3D形注塑热塑性部件上使多功能应用。特别是基于激光的图案化技术结合选择性金属化显示了各种小型化应用的高能力。通过最小化的光斑尺寸，所谓的LPKF-LDS工艺中的激光系统是一种精细的图案化工具，并且通过简单地调整激光处理参数，非常灵活。在本文中，描述了一种用于激光直接结构（LDS LCP）的新型液晶聚合物材料上的细间距金属沉积的新方法。

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《International Conference on Multi-Material Micro Manufacture》|2015年||共4页
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H. Mueller; S. Weser; W. Eberhardt; H. Kuck;
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中图分类 TH16-53;
关键词
Moulded Interconnect Devices (MID); LPKF-LDS; Fine pitch; Electroless Cu/Ag; Electroless Cu/Pd/Au;

机译：模压互连器件（中间）;LPKF-LDS;细间距;化学型CU / AG;化学型CU / PD / AU;

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1. Low Thermal Expansion and Fine-Pitch Metal Masks Fabricated via Invar Fe-Ni Alloy Electroforming for Large Fine-Pitch OLED Displays [J] . Tomio Nagayama, Takayo Yamamoto, Toshihiro Nakamura SID International Symposium: Digest of Technology Papers . 2017,第1期

机译：通过Invar Fe-Ni合金电铸造的低热膨胀和细间距金属面罩，用于大型细致OLED显示器
2. Materials and Processes Issues in Fine Pitch Eutectic Solder Flip Chip Interconnection [J] . Liu C., Hendriksen M. W., Hutt D. A., IEEE Transactions on Components and Packaging Technologies . 2006,第期

机译：细间距共晶倒装芯片互连中的材料和工艺问题
3. Atomic Layer Deposition (ALD) grown thin films for ultra-fine pitch pixel detectors [J] . J. Haerkoenen, J. Ott, M. Maekelae, Nuclear Instruments & Methods in Physics Research. Section A, Accelerators, Spectrometers, Detectors and Associated Equipment . 2016,第sepa21期

机译：用于超细间距像素检测器的原子层沉积（ALD）生长薄膜
4. Fine Pitch Metal Deposition on LDS Materials [C] . H. Mueller, S. Weser, W. Eberhardt, International Conference on Multi-Material Micro Manufacture . 2015

机译：LDS材料上的细间距金属沉积
5. Temperature-dependent extended electron energy loss fine structure measurements from K, L(23), and M(45) edges in metals, intermetallic alloys, and nanocrystalline materials. [D] . Okamoto, James Kozo. 1993

机译：从金属，金属间合金和纳米晶体材料中的K，L（23）和M（45）边缘得出的温度相关的扩展电子能量损耗精细结构测量结果。
6. Effectiveness of Devices to Monitor Biofouling and Metals Deposition on Plumbing Materials Exposed to a Full-Scale Drinking Water Distribution System [O] . Maneesha P. Ginige, Scott Garbin, Jason Wylie, -1

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7. Under bump metallisation of fine pitch flip-chip using electroless nickel deposition [O] . Liu, C, Hutt, D A, Whalley, D C, 2000

机译：使用化学镀镍进行细间距倒装芯片的凸点金属化
8. High Deposition Welding. Volume 2. Use of Powder Metal Filler Materials for High Deposition Rate One - Side Welding. [R] . 1978

机译：高沉积焊接。第2卷。使用粉末金属填料材料进行高沉积速率的单面焊接。

Fine Pitch Metal Deposition on LDS Materials

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