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首页> 外文会议>Annual Conference of the Chinese Society of Micro-Nano Technology >Fabrication and Performance Simulation of Microscale Thermoelectric Modules made with Bi_2Te_3-based Alloys
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Fabrication and Performance Simulation of Microscale Thermoelectric Modules made with Bi_2Te_3-based Alloys

机译：用Bi_2Te_3基合金制备的微观热电模块的制造和性能模拟

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摘要

Micro or nano scale thermoelectric (TE) modules have received increasing attention because of their potential applications as energy supplying and thermal managing components in microelectronic devices and micro-electro-mechanical systems (MEMS). In the present work, microscale thermoelectric modules are fabricated by combining mechanical cutting and photolithograph processes from nano-sized silicon carbide (SiC) particles reinforced Bi_2Te_3-based materials (Bi_2Te_3 for n type, and Bi_(0.5)Sb_(1.5)Te_3 for p type) prepared by spark plasma sintering (SPS). The fabricated modules have 28 pairs of thermoelectric legs in an area of 3 x 3 mm~2, and each of them is 200 x 400 μm~2 in cross section and 600 urn in length, which is connected in series by Ni-Cu electrodes made with photolithograph patterning and magnetron sputtering. The thermoelectric performances of a p-n couple are simulated with the finite element method (FEM) under a thermal-electrical coupled multi-physics field for both electronic cooling (Peltier effect) and thermoelectric energy generation (Seebeck effect) working mold.
机译：由于其作为微电子器件和微电机械系统（MEMS）中的能量供应和热管理组件，微型或纳米级热电（TE）模块已获得越来越长的关注。在本作本作中，通过将来自纳米碳化硅（SiC）颗粒增强的Bi_2Te_3基材料的机械切割和光刻工艺组合来制造微尺寸热电模块（Bi_2Te_3的N型，以及P的Bi_2Te_3和P的Bi_（0.5）SB_（1.5）TE_3通过火花等离子体烧结（SPS）制备的类型。制造的模块在3×3mm〜2的面积中具有28对热电腿，并且它们中的每一个在横截面中为200×400μm〜2，长度为600瓮，由Ni-Cu电极串联连接用光刻图案化和磁控溅射制成。通过在热电耦合多物理领域下用有限元方法（FEM）模拟P-N耦合的热电性能，用于电子冷却（珀耳帖效应）和热电能源（Seebeck效应）工作模具。

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