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首页> 外文期刊>Journal of Micromechanics and Microengineering >Fabrication and evaluation of microscale thermoelectric modules of Bi_2Te_3-based alloys
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Fabrication and evaluation of microscale thermoelectric modules of Bi_2Te_3-based alloys

机译：Bi_2Te_3基合金微尺度热电模块的制备与评价

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摘要

Microscale thermoelectric modules are fabricated by a facile process based on mechanical cutting combined with photolithography processes. Fine-grained materials of p-type Bi_(0.5)Sb_(1.5)Te_3 and n-type Bi_2Te_3 dispersed with 0.5 vol% nano-SiC particles 'which show improved mechanical strength than that without SiC additions, were prepared by spark plasma sintering (SPS) for the module microfabrication. The fabricated modules have 28 pairs of thermoelectric legs, each of them being as fine as 200 × 400μm~2 in cross-section with a height up to 600μm, which were connected in series by Ni-Cu electrodes made by photolithographic patterning and magnetron sputtering. Such a microscale module was evaluated under both Seebeck and Peltier working modes. According to the Seebeck mode, when the module is heated under a lamp, the maximum open output voltage and the maximum output power are about 20 mV and 0.15 μW (1.6 μW cm~(-2)), respectively. In the Peltier mode, a temperature difference of approximately 7 K is obtained with the input current of 4 mA.
机译：微型热电模块是通过基于机械切割和光刻工艺的简易工艺制造的。通过火花等离子烧结制备了p型Bi_（0.5）Sb_（1.5）Te_3和n型Bi_2Te_3分散有0.5vol％纳米SiC颗粒的细颗粒材料，这些材料的机械强度比不添加SiC的要好。 SPS）用于模块的微细加工。制作的模块具有28对热电腿，每对腿的横截面细至200×400μm〜2，高度可达600μm，并通过光刻图形和磁控溅射镍铜电极串联连接。 。在Seebeck和Peltier工作模式下都对这种微型模块进行了评估。根据塞贝克模式，当在灯下加热模块时，最大开路输出电压和最大输出功率分别约为20 mV和0.15μW（1.6μWcm〜（-2））。在Peltier模式下，输入电流为4 mA时，可获得约7 K的温差。

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