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Model based FMEA for electronic products

机译：基于模型的电子产品FMEA

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Failure Mode and Effect Analysis (FMEA) has been developed and applied to a variety of electronic products. The FMEA method adopts a reverse thinking of the cause-failure-effect logic, the analyzing of all possible failure modes in an electric product is performed first then their failure causes are searched, which required rich experience in projects of analyst and waste time on those failure modes which unlikely happened. Besides, the environmental factors and structure of modern electronic products is complicated and the traditional FMEA cannot guarantee the adequacy of the failures analysis base on failure mechanism. Starting from the possible loadings of electronic product, a novel model-based FMEA (MB-FMEA) approach with positive thinking is proposed which finding failure mechanisms and modes of the components caused by the loadings and analyzing coupling relationships between them. The relationships between loadings and components, interactions among failure modes can be searched out by a transfer chain model. Application of the proposed approach is shown through the case of a strain test PCB which indicates the method can be used for reliability analysis and PHM of any electronic product.
机译：已经开发出故障模式和效果分析（FMEA）并应用于各种电子产品。该FMEA方法采用因果失效效应逻辑的逆向思维，首先执行的所有可能的故障模式中的电子产品的分析，然后他们的失败原因进行了搜查，这需要丰富的那些分析师和浪费时间的项目经验失败模式不太可能发生。此外，现代电子产品的环境因素和结构复杂，传统的FMEA无法保证故障分析基础的充分性。从电子产品的可能负载开始，提出了一种具有积极思维的新型模型的FMEA（MB-FMEA）方法，该方法发现了由装载引起的组件的故障机制和模式，并分析它们之间的耦合关系。负载和组件之间的关系，故障模式之间的相互作用可以通过传输链模型搜索。通过应变试验PCB的情况显示所提出的方法的应用，该方法表示该方法可用于任何电子产品的可靠性分析和PHM。

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