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Customizable silicone materials for MEMS and semiconductor packages

机译：用于MEMS和半导体包装的可定制硅胶材料

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Micro Electro Mechanical Systems (MEMS) are enabling the merger of various sensing capabilities into a single device, and are used in many different applications. Largely employed in the handheld sector, which is driving MEMS growth, smartphones today can contain as many as ten to twelve - or even more - MEMS devices, with this number projected to grow in the coming years. Automotive integration of MEMS is also in the fast lane. Pressure sensors, speed sensors, air flow sensors, GPS systems and accelerometers - all are driven by MEMS and are critical elements to proper automobile function and efficiency. Manufacturing MEMS devices is a balancing act, as MEMS die are very sensitive and fragile. Too much stress from die bonding may crack the die and, if the bonding adhesive's modulus is high, the die can bend due to stress. This flex can cause the moving parts of the MEMS to go out of calibration. To accommodate these stress and modulus challenges, a silicone material technology for MEMS devices which offers a low and stable modulus across the reflow profile has been developed. The material has no bleed and higher adhesion strength than previous-generation adhesives and is completely customizable. The unique Silicone platform has been developed with the freedom to adjust not only the rheological properties, but other key material properties such as modulus as well. Different color samples can also be developed based on product requirements.
机译：微电器机械系统（MEMS）能够将各种传感能力的合并到单个设备中，并用于许多不同的应用中。在驾驶MEMS增长的手持部门很大程度上，今天的智能手机可以包含多达十到十二 - 或甚至更多 - MEMS设备，其中该号码预计未来几年增长。 MEMS的汽车集成也在快车道中。压力传感器，速度传感器，空气流传感器，GPS系统和加速度计 - 所有这些都由MEMS驱动，是适当的汽车功能和效率的关键元素。制造MEMS器件是一种平衡行为，因为MEMS DIE非常敏感和脆弱。模具粘合的压力太大可能破裂模具，如果粘合粘合剂的模量高，则模具可以由于应力而弯曲。该柔性可能导致MEMS的移动部分超出校准。为了适应这些压力和模量挑战，已经开发了一种用于在回流轮廓上提供低稳定模量的MEMS器件的硅胶材料技术。该材料没有比先前的粘合剂的渗出和更高的粘合强度，并且是完全可定制的。独特的硅胶平台已经通过自由度开发，不仅可以调节流变性能，而且还具有变流性特性，而是也是模量的其他关键材料特性。还可以根据产品要求开发不同的颜色样本。

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