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Study of polyimide coated chip and mold compound adhesion

机译：聚酰亚胺涂层芯片和霉菌复合粘附研究

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This study investigates the adhesion strength between polyi-mide coated chip and epoxy mold compound (EMC). Polyi-mide is an important material to reduce chip stress and protect the mobility ions from EMC to the chip circuitry that can lead to an electrical failure. However, there was a delamination issue between encapsulation material and polyimide during reliability test. Two samples were prepared named as EMC A (sample without adhesion promoter) and EMC B (sample with adhesion promoter). Prior to curing process, wafers were coated with 7±1 μm thickness of polyimide using spin coating process. Then, samples were cured at 175 °C for 5 hours in oven after molding process. Samples were then soaked in the Autoclave test chamber (ACLV) at 121°C with 100% relative humidity (RH) for 0.5 hour, 1 hour, 1.5 hours and 2 hours to test the sample reliability. Adhesion strength was measured at room temperature and 260 °C. In addition, water absorption with varies moisture sensitivity level (MSL) was carried out. The MSL test was set for three level which were 85 °C / 85% RH, 85 °C / 60% RH and 30 °C / 60% RH for level 1, 2 and 3, respectively. There was a significant different on moisture absorption but less significant in delamination response. Based on the strength test, EMC B showed a gap between polyimide and mold compound after 0.5 hour of ACLV test while no gap was observed for EMC A even after 2 hours of ACLV test. It could be concluded that EMC that formulated with adhesion promoter provided significant factor to the delamination issue compared with EMC without adhesion promoter.
机译：本研究研究了多聚酰胺涂层芯片和环氧树脂（EMC）之间的粘附强度。 Polyi-Mide是减少芯片应力的重要材料，并将移动离子免受EMC保护可导致电气故障的芯片电路。然而，在可靠性测试期间封装材料和聚酰亚胺之间存在分层问题。制备两个样品名为EMC A（没有粘合促进剂的样品）和EMC B（用粘合促进剂的样品）。在固化过程之前，使用旋涂工艺用7±1μm的聚酰亚胺涂覆晶片。然后，在模制过程后，在烘箱中在175℃下固化样品5小时。然后将样品浸泡在高压釜测试室（ACLV）的121℃下，100％相对湿度（RH）为0.5小时，1小时，1.5小时和2小时，以测试样品可靠性。在室温和260℃下测量粘合强度。此外，进行了水分敏感水平（MSL）的吸水率。将MSL测试设置为3级，其为85℃/ 85％RH，85℃/ 60％RH和30°C / 60％RH，分别为1,2和3级。在湿度吸收下有显着不同，但在分层反应中的显着较小。基于强度试验，EMC B在0.5小时ACLV试验后的聚酰亚胺和模霉菌化合物之间存在间隙，同时均匀在ACLV试验中均未观察到EMC A的间隙。可以得出结论，与粘合促进剂配制的EMC与没有粘连促进剂的EMC相比为分层问题提供了显着的因素。

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