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首页> 外文会议>International conference and exhibition on multichip modules >CD3D: A Constraint-driven 3-dimensional Router for Thick Film Mcms
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CD3D: A Constraint-driven 3-dimensional Router for Thick Film Mcms

机译：CD3D：用于厚膜MCM的约束驱动的三维路由器

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摘要

Physical design is currently a bottleneck in widespread use of MCMs. In particular, routing of a complex MCM while satisfying several performance, electrical and manufacturing constraints is a challenging problem. A router for thick film MCMs is presented in this paper. This will router partitions the whole MCM routing space into a set of small towers and decompose the routing process into three phases, viz, routing distribution, terminal assignment, and tower routing. The router has three fundamental features. First, it maintains the 3-dimensional characteristics of the original problem while partitioning it into several smaller problems and as a result, it can achieve the best utilization of the routing space. Second, it is designed to meet the constraints of net-length, path-separation, parallel-path-length, and the number of stacked vias and thus can satisfy the design requirement of high performance MCMs. Finally, the approach is amiable to parallel processing which can be used to improve the time complexity and memory constraints in a parallel computing environment. Experimental evaluation confirms the validity of our approach.
机译：物理设计目前是广泛使用MCM的瓶颈。特别地，复杂MCM的路由在满足几个性能，电气和制造限制的同时是一个具有挑战性的问题。本文提出了一种用于厚膜MCM的路由器。这将路由器将整个MCM路由空间分区为一组小塔，并将路由过程分解为三个阶段，VIZ，路由分配，终端分配和塔路由。路由器有三个基本功能。首先，它保持原始问题的三维特征，同时将其分成几个较小的问题，结果可以实现路由空间的最佳利用率。其次，它旨在满足净长度，路径分离，平行路径长度和堆叠通孔的数量的约束，因此可以满足高性能MCM的设计要求。最后，该方法可以与并行处理和平处理，该处理可用于改善并行计算环境中的时间复杂性和内存约束。实验评估证实了我们的方法的有效性。

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