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首页> 外文会议>Pacific Rim/ASME international intersociety electronic photonic packaging conference >An engineering model to simulate the thermal response of electronic devices during pulsed Nd:YAG laser welding
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An engineering model to simulate the thermal response of electronic devices during pulsed Nd:YAG laser welding

机译：模拟脉冲Nd：YAG激光焊接电子设备热响应的工程模型：YAG激光焊接

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摘要

A model is developed to predict the thermal response of "real" electronic devices during pulsed Nd:YAG laser welding. Modeling laser-part interaction requires incorporation of weld pool hydrodynamics, and laser-metal vapor and laser-surfaceinteractions. Although important information can be obtained from these models, they are not appropriate for use in design of actual components due to computational limitations. In lieu of solving for these detailed physics, a simple model is constructed. In this model, laser-part interactions are accounted for through an empirically determined energy transfer efficiency which is developed through the use of modeling and experiments. This engineering model is appropriate since the thermal response oftemperature sensitive components away from the weld pool is the primary interest here. Reasonable agreement between predictions and experimental measurements for welding of real components are indicated.
机译：开发了一种模型以预测脉冲Nd：YAG激光焊接期间“真实”电子设备的热响应。建模激光零件相互作用需要掺入焊接池流体动力学和激光 - 金属蒸气和激光表面互动。虽然可以从这些模型中获得重要信息，但它们不适合由于计算限制而设计实际组件。代替解决这些详细的物理学，构建了一个简单的模型。在该模型中，通过经验确定的能量转移效率来占激光零件相互作用，这是通过使用建模和实验而开发的。该工程模型是合适的，因为远离焊接池的温度敏感元件的热响应是这里的主要兴趣。指出了预测与实验测量的合理一致性，用于焊接真实部件的焊接。

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