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Simulation of Microstructural Evolution During Thermomechanical Cycling in Pb-Sn Solders

机译：PB-SN焊料热机械循环过程中微观结构演化的仿真

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Pb-Sn solders are known to coarsen and deform heterogeneously under shear thermomechanical cycling.Solder joint failure often occurs within these coarsened shear bands.The connection between microsture and materials properties is well documented,which leads to the conculsion that an improved understanding of the interaction between stress and microstructural evolution will better enable the prediction of materials properties over time.In this paper,we simulate microstructural evolution of Pb-Sn solders using a novel two-phase version the Potts model,a kinetic Monte Carlo model that is coupled to a finite elment mechanics model.Using this model,possible mechanisms for heterogneeous coarsening are explored.
机译：已知PB-SN焊料在剪切热机械循环下粗原油和变形。在这些粗发的剪切带中经常发生在剪切的接头失败。微压和材料性能之间的连接良好，这导致了改善对互动的理解压力和微观结构的进化之间会随着时间的推移更好地实现材料性能的预测。本文使用新型两相版本的PB-SN焊料模拟PB-SN焊料的微观结构演化，其耦合到A的动力学蒙特卡罗模型有限的Elitment Mechancy模型。探讨了这种模型，探索了异常粗化的可能机制。

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