Microstructural Evolution in the Sn-Cu-Ni and Pb-Sn Solder Joints with Cu and Pt-Ag Metallized Al_2O_3 Substrate

C.C. Young; J.G. Duh; S.Y. Tsai

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Microstructural Evolution in the Sn-Cu-Ni and Pb-Sn Solder Joints with Cu and Pt-Ag Metallized Al_2O_3 Substrate

机译：Cu和Pt-Ag金属化的Al_2O_3衬底在Sn-Cu-Ni和Pb-Sn焊点中的显微组织演变

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摘要

The growth mechanism of intermetallics between solders and metallized sub-strates, after thermal aging, are investigated.

机译：研究了热老化后焊料与金属化基体之间金属间化合物的生长机理。

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来源
《Journal of Electronic Materials》 |2001年第9期|共8页
作者
C.C. Young; J.G. Duh; S.Y. Tsai;
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正文语种 eng
中图分类材料;
关键词
lead-free solder; intermetallic compound; metallization; micro-structural evolution; interfacial morphology;

机译：无铅焊料;金属间化合物;金属化;微观结构演变;界面形态;

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专利

1. Microstructural Evolution in the Sn-Cu-Ni and Pb-Sn Solder Joints with Cu and Pt-Ag Metallized Al_2O_3 Substrate [J] . C.C. Young, J.G. Duh, S.Y. Tsai Journal of Electronic Materials . 2001,第9期

机译：Cu和Pt-Ag金属化的Al_2O_3衬底在Sn-Cu-Ni和Pb-Sn焊点中的显微组织演变
2. Impact of Ni concentration on the intermetallic compound formation and brittle fracture strength of Sn-Cu-Ni (SCN) lead-free solder joints [J] . Chaoran Yang, Fubin Song, S.W. Ricky Lee Microelectronics & Reliability . 2014,第2期

机译：Ni浓度对Sn-Cu-Ni（SCN）无铅焊点金属间化合物形成和脆性断裂强度的影响
3. Microstructural Evolution of Intermetallic Compounds in TCNCP Cu Pillar Solder Joints [J] . Liang Chien-Lung, Lin Kwang-Lung, Peng Jr-Wei Journal of Electronic Materials . 2016,第1期

机译：TCNCP铜柱焊点中金属间化合物的微观结构演变
4. Evaluation of the Effects of Au Content on Intermetallic Compound Layer Growth in Pb-Sn and Sn-Ag-Cu Solder Joints [C] . D. F. Susan, P. T. Vianco, J. A. Rejent, International Brazing and Soldering Conference . 2006

机译：Au含量对PB-Sn和Sn-Ag-Cu焊点金属间化合物层生长的评价
5. Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes under isothermal aging in mixed solder joints [D] . Choubey, Anupam 2007

机译：锡铅和无铅焊点在等温老化下的微观结构变化及其对热疲劳可靠性的影响，包括混合焊点在等温老化下的微观结构变化
6. The Role of Intermetallic Compounds in Controlling the Microstructural Physical and Mechanical Properties of Cu-Sn-Ag-Cu-Bi-Cu Solder Joints [O] . Reza Sayyadi, Homam Naffakh-Moosavy -1

机译：金属间化合物在控制Cu- Sn-Ag-Cu-Bi-Bi -Cu钎焊接头的微结构物理和力学性能中的作用
7. Influence of Initial Morphology and Thickness of Cu6Sn5 and Cu3Sn Intermetallics on Growth and Evolution during Thermal Aging of Sn-Ag Solder/Cu Joints [O] . X. Deng, G. Piotrowski, J. J. Williams, 2003

机译：Cu-snO和Cu3sn金属间化合物初始形貌和厚度对sn-ag焊料/ Cu接头热老化过程中生长和演变的影响

Microstructural Evolution in the Sn-Cu-Ni and Pb-Sn Solder Joints with Cu and Pt-Ag Metallized Al_2O_3 Substrate

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