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首页> 外文会议>Symposium on Modeling and Numerical Simulation of Materials Behavior and Evolution, Apr 2-5, 2002, San Francisco, California >Simulation of Microstructural Evolution During Thermomechanical Cycling in Pb-Sn Solders
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Simulation of Microstructural Evolution During Thermomechanical Cycling in Pb-Sn Solders

机译：铅锡焊料热机械循环过程中微观结构演变的模拟

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摘要

Pb-Sn solders are known to coarsen and deform heterogeneously under shear thermomechanical cycling. Solder joint failure often occurs within these coarsened shear bands. The connection between microstructure and materials properties is well documented, which leads to the conclusion that an improved understanding of the interaction between stress and microstructural evolution will better enable the prediction of materials properties over time. In this paper, we simulate microstructural evolution of Pb-Sn solders using a novel two-phase version the Potts model, a kinetic Monte Carlo model that is coupled to a finite element mechanics model. Using this model, possible mechanisms for heterogeneous coarsening are explored.
机译：已知Pb-Sn焊料在剪切热机械循环中会粗化和异质变形。焊点失效通常发生在这些粗糙的剪切带内。微观结构与材料性能之间的联系已得到充分证明，从而得出结论，对应力与微观结构演变之间的相互作用的更好理解将更好地实现随时间推移对材料性能的预测。在本文中，我们使用新颖的两相版本Potts模型（耦合到有限元力学模型的动力学蒙特卡洛模型）模拟Pb-Sn焊料的微观结构演变。使用该模型，探索了异质粗化的可能机制。

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