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Integrated, Virtual Plant Design and Commissioning Methodology using Digital Manufacturing and Lean Principles

机译:使用数字制造和精益原则的集成,虚拟工厂设计和调试方法

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New and unprecedented changes in customer demands, globalization, cost pressures, innovative product development strategies to shorten product development time, and changing external landscape with reduction of trade barriers, poses challenges and opportunities for the manufacturing industry. Customer demands and needs require modification and reconfiguration of existing manufacturing and assembly plants as well as creation and setup of new 'Greenfield' facilities in developing countries. Currently, the solutions provided by most service providers focuses on limited elements of the solution methodology. We have developed an integrated methodology to perform virtual plant commissioning using digital manufacturing, design for six sigma and lean manufacturing principles. Starting from product definition, the paper goes into the depth of macro- and micro-level plant layout, line layout and definition, line simulation, line balancing, optimization of line and process plans, tooling station detail, material flow, and kitting of modules. It integrates design at plant level, line level, station level and equipment level and as a result of this approach; multiple what-if scenarios are evaluated and visualized in 3D, early on in the product development process, before the need for investment in plant infrastructure. In addition, this methodology helps simulate the movement of a 3D digital prototype through a virtual plant; thereby helping reduce 'unpredicted' product launch costs and corrective tear-up of physical infrastructure.
机译:客户需求的新和前所未有的变化,全球化,成本压力,创新的产品开发策略,以缩短产品开发时间,并通过减少贸易壁垒改变外部景观,为制造业带来了挑战和机遇。客户需求和需求需要改进和重新配置现有的制造和装配工厂以及在发展中国家的新“格林菲尔德”设施的创作和设置。目前,大多数服务提供商提供的解决方案专注于解决方案方法的有限元素。我们开发了一种综合方法,可以使用数字制造,设计六西格玛和精益制造原则进行虚拟工厂调试。从产品定义开始,本文进入了宏观和微级设备布局的深度,线路布局和定义,线仿真,线路平衡,线路和过程计划的优化,模具站详细信息,材料流量和模块的套件。它集成了工厂水平,线路电平,站等级和设备水平的设计,并由于这种方法;在产品开发过程的早期在3D中,在植物基础设施投资之前,在3D中评估和可视化的多个内容。此外,该方法有助于通过虚拟工厂模拟3D数字原型的移动;因此,帮助减少“不受预测的”产品发射成本和纠正物理基础设施的撕裂。

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