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CVD Filling of Narrow Deep 4H-SiC Trenches in a Quasi-Selective Epitaxial Growth Mode

机译:准选择性外延生长模式中的CVD填充窄深4H-SIC沟槽

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By mapping the flow rates of source and HCI gases dependent growth rates, the CVD process window of a quasi-selective epitaxial growth (quasi-SEG) was first found for a 5-μm 4H-SiC trench. It ensures an extremely low risk of void defects generation due to very thin epilayers on the mesa top. Based on the acquired knowledge, a 25-μm 4H-SiC trench with an aspect ratio up to~10 was completely filled in the quasi-SEG mode.
机译:通过映射源源和HCI气体的流速依赖性生长速率,首先发现了准选择性外延生长(准选择性外延生长的CVD处理窗口,用于5μm4H-SiC沟槽。它确保了由于台面上的非常薄的脱节剂而产生极低的空隙缺陷的风险。基于所获取的知识,在准筛选模式下完全填充具有高达〜10的纵横比的25μm的4H-SiC沟槽。

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