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首页> 外文会议>International Conference on Multi-functional Materials and Structures >The effect of heat treating on the microstructure and mechanical properties of Cr-Cu-N nanocomposite thin films
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The effect of heat treating on the microstructure and mechanical properties of Cr-Cu-N nanocomposite thin films

机译：热处理对Cr-Cu-n纳米复合薄膜的微观结构和力学性能的影响

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The Cr-Cu-N nanocomposite thin films with copper contents ranging from 1.6 to 24.1 at.% were deposited on silicon wafer substrates using a bipolar asymmetry pulsed DC reactive magnetron sputtering system. A dense and compact structure was observed for the thin film containing higher than 10.2 at.% Cu, whereas columnar structures were revealed on the coatings with less than 10.2 at.% Cu. Heat treatments of the as-deposited thin films were held in a vacuum tube furnace at 400, 450 and 500°C for 30 minutes, respectively. It was observed that the copper atoms would diffuse to the surface to form oxide particles on the coating contained higher Cu content after heating higher than 450°C. The quantity and size of the oxide particles increased with increasing heating temperature and Cu content in the thin film. The hardness of coatings increased after heating except #D thin film containing 24.1 at.% Cu, which the softening effect was found after heating at 500°C. A granular and less dense cross-sectional morphology was observed on #D coating after heat treating at 500°C, which was responsible for the lower hardness of thin film.
机译：使用双极不对称脉冲DC反应磁控溅射系统，在硅晶片基板上沉积在1.6至24.1的铜含量的Cr-Cu-n纳米复合薄膜。对于含有高于10.2at的薄膜，观察到致密且紧凑的结构。％Cu，而柱状结构在涂层上露出，在小于10.2℃。％Cu。将沉积的薄膜的热处理分别在400,450和500℃下保持在真空管炉中30分钟。观察到铜原子将扩散到表面上以形成涂层上的氧化物颗粒在加热高于450℃后含有较高的Cu含量。随着薄膜中的加热温度和Cu含量增加，氧化物颗粒的数量和尺寸增加。除了含有24.1℃的#d薄膜外，涂层的硬度增加。％Cu，在500℃下加热后发现软化效果。在500℃下热处理后，在#d涂层上观察到粒状和更少的致密横截面形态，这对薄膜的硬度负责。

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