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The effect of heat treating on the microstructure and mechanical properties of Cr-Cu-N nanocomposite thin films

机译:热处理对Cr-Cu-N纳米复合薄膜微观结构和力学性能的影响

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The Cr-Cu-N nanocomposite thin films with copper contents ranging from 1.6 to 24.1 at.% were deposited on silicon wafer substrates using a bipolar asymmetry pulsed DC reactive magnetron sputtering system. A dense and compact structure was observed for the thin film containing higher than 10.2 at.% Cu, whereas columnar structures were revealed on the coatings with less than 10.2 at.% Cu. Heat treatments of the as-deposited thin films were held in a vacuum tube furnace at 400, 450 and 500℃ for 30 minutes, respectively. It was observed that the copper atoms would diffuse to the surface to form oxide particles on the coating contained higher Cu content after heating higher than 450℃. The quantity and size of the oxide particles increased with increasing heating temperature and Cu content in the thin film. The hardness of coatings increased after heating except #D thin film containing 24.1 at.% Cu, which the softening effect was found after heating at 500℃. A granular and less dense cross-sectional morphology was observed on #D coating after heat treating at 500℃, which was responsible for the lower hardness of thin film.
机译:使用双极不对称脉冲直流反应磁控溅射系统,将铜含量范围为1.6至24.1 at。%的Cr-Cu-N纳米复合薄膜沉积在硅晶片基板上。对于包含高于10.2at。%的Cu的薄膜,观察到致密且致密的结构,而在具有少于10.2at。%的Cu的涂层上显示出柱状结构。将沉积的薄膜在真空管式炉中分别在400、450和500℃下热处理30分钟。观察到,当加热到高于450℃时,铜原子会扩散到表面形成氧化物颗粒,而涂层中的铜含量更高。氧化物颗粒的数量和尺寸随着加热温度和薄膜中Cu含量的增加而增加。加热后,涂层的硬度有所提高,但#D薄膜中含有24.1 at。%的Cu,在500℃加热后发现软化效果。在500℃热处理后,#D涂层观察到颗粒状和致密的横截面形貌,这是造成薄膜硬度降低的原因。

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