The essential similarity of the ribbon bonding process to the long-established and well-understood large-diameter aluminum wire bonding process means that surface metallizations that are successfully bonded with wire can be bonded with ribbon. Inspection methods and failure modes for ribbon are similar to round wire and can often be evaluated with the same measurement systems. Automated wire bonders can be converted to ribbon and retraining of operators and technicians is minimal. A wide range of ribbon sizes makes the process useful for a wide range of applications, including applications with very high current requirements. Ribbon bonding is environmentally-friendly and can bond solar modules and other applications that are typically soldered. The low loops and high currents possible with ribbon make it the preferred interconnect for many discrete power packages. Ribbon is suitable for small, thin packages with severe constraints on loop height, such as SO-8 or PQFN, and for larger high-current packages, such as DPAK or TO-220.
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