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The Use of Ultrasonic Bond Waveforms as an Alternative Low-Cost Method for Process Control for High Volume Automotive Electronic Modules - (PPT)

机译：使用超声波键波形作为高批量汽车电子模块的过程控制的替代低成本方法 - （PPT）

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With automotive-electronic modules, the on-going process control of heavy aluminum wire bonding on high-volume production became expensive when destructive testing is utilized. The large number of modules used during production for control charting purposes is quite expensive. This paper will discuss how a statistical process control can be enhanced by frequent observations of ultrasonic bond traces without a degradation of quality.

机译：通过汽车 - 电子模块，在利用破坏性测试时，高批量生产上的重型铝线键合的正在进行的过程控制变得昂贵。用于控制图表的生产过程中使用的大量模块非常昂贵。本文将讨论如何通过频繁观察超声波绑定痕迹而不会产生质量的劣化的方式如何增强统计过程控制。

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《IMAPS and SEMI Topical Workshop on Wire Bonding》|2011年||共16页
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Mario Marin;
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4. The Use of Ultrasonic Bond Waveforms as an Alternative Low-Cost Method for Process Control for High Volume Automotive Electronic Modules - (PPT) [C] . Mario Marin IMAPS and SEMI Topical Workshop on Wire Bonding . 2011

机译：使用超声波键波形作为高批量汽车电子模块的过程控制的替代低成本方法 - （PPT）
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The Use of Ultrasonic Bond Waveforms as an Alternative Low-Cost Method for Process Control for High Volume Automotive Electronic Modules - (PPT)

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