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Stress engineering using AlN/GaN superlattices for epitaxy of GaN on 200 mm Si wafers

机译:使用ALN / GAN超晶格的压力工程在200 mm Si晶片上的GaN外延

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Stress control using AlN/GaN superlattices (SLs) for epitaxy of GaN on 200 mm Si (111) substrates is reported. Crack-free 2 μm GaN layers were grown over structures containing 50 to 100 pairs of 3-5 nm AlN/10-30 nm GaN SLs. Compressive and tensile stress can be precisely adjusted by changing the thickness of the AlN and GaN layers in the SLs. For a constant period thickness, the effects of growth conditions, such as growth rate of GaN, V/III ratio during AlN growth, and growth temperature, on wafer stress were investigated.
机译:报道了对200mM Si(111)衬底上的GaN外延的ALN / GaN超晶格(SLS)的应力控制。在含有50至100纳米ALN / 10-30nm GaN SLS的结构上生长无裂缝2μmGaN层。可以通过改变SLS中的ALN和GaN层的厚度来精确调节压缩和拉伸应力。对于恒定周期厚度,研究了生长条件的影响,例如GaN的生长速率,v / III比在AlN生长期间和生长温度,晶片胁迫期间。

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