• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文会议>International Conference on Advanced Engineering Materials and Technology >Design and simulation of molded interconnect devices with two shot molding
【24h】

Design and simulation of molded interconnect devices with two shot molding

机译：两次射击成型模制互连器件的设计与仿真

获取原文
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

Three Dimensional Molded Interconnect Devices (3D-MID) has enormous potential for rationalization in both manufacturing process and the freedom to design of mechatronic products. Two shot molding is one of the most important and commonly used methods among the various MID manufacturing processes. Currently, there is a lack of effective design and simulation tools that can be used for MID with two shot molding. In this paper, an integrated product model using feature technology, some MID-specific design functions, and one special interface based on the API of Moldflow Plastics Insight (MPI) and the COM-Technology are presented. These developed product model, functions and interface increase the efficiency of the MID design process, and the design and simulation integrated environment also towards the rational and optimal design of MID products with two shot molding.
机译：三维模压互连装置（3D-MID）在制造过程中具有巨大的合理化潜力和机电产品设计的自由度。两个射击成型是各种中型制造过程中最重要且常用的方法之一。目前，缺乏有效的设计和仿真工具，可用于中间的两个射击成型。本文采用了一种使用特征技术，一些中等设计功能的集成产品型号，以及基于模型塑料洞察力（MPI）API和COM-Technology的一个特殊接口。这些开发的产品型号，功能和界面提高了中型设计过程的效率，以及设计和仿真综合环境也朝向中产品的理性和最优设计，有两个射击成型。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号