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首页> 外文会议>IMAPS International Conference and Tabletop Exhibition on High Temperature Electronics >Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability
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Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability

机译：高级TJ SIC应用的共晶Zn-Al模具附件：制造方法和模具剪切强度可靠性

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摘要

This paper comprehensively describes the fabrication method and shear strength reliability of a eutectic Zn-Al (m.p. = 382°C) attachment system, built by soldering SiC dies (2×2 mm~2) onto Cu foil active-metal-brazed with a SiN ceramic plate. Four essential soldering conditions are presented and discussed for the formation of a strong and reproducible attachment. Die shear strength reliability data at Tj = 250°C are reported here for the first time. Storage tests at 250°C revealed that, after an initial slight decline, die shear strength stayed virtually constant at a sufficient level (～110 MPa) for at least 3000 hours. Thermal cycle test results indicated that the attachments can withstand thermal cycle stress for 3000 cycles between -40°C and 250°C. The average die shear strength after 3000 cycles was 18.5 MPa, a value that is three times higher than the IEC standard of 6.2 MPa specified in Document 60749-19.
机译：本文全面地描述了共晶Zn-Al（MP = 382°C）附着系统的制造方法和剪切强度可靠性，通过焊接SiC模具（2×2mm〜2）构建在Cu箔上的Cu箔 - 钎焊中Sin陶瓷板。提出并讨论了四种必需的焊接条件，形成了强度和可重复的附件。 TJ = 250°C的模具剪切强度可靠性数据首次在此报告。 250°C的储存试验显示，在初始轻微下降之后，模具剪切强度在足够的水平（〜110MPa）保持几乎至少3000小时。热循环测试结果表明，附件可以承受热循环应力，在-40°C和250°C之间进行3000个循环。 3000个循环后的平均模剪强度为18.5MPa，值高于文件60749-19中规定的6.2 MPa的IEC标准的三倍。

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