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Tensile Response of Adhesively Bonded Composite-to-composite Singlelap Joints in the Presence of Bond Deficiency

机译:粘结复合物与复合单键在粘合缺乏症存在下的拉伸响应

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This paper studies the quasi-static tensile response of adhesively bonded composite-to-composite single-lap joints in the presence of weak and kissing bonds, as an attempt for characterisation of bond deficiencies likely to occur in polymer composite bonded repair. Cytec FM 94 adhesive film (0.25mm nominal thickness) was used for all joints to bond two 2mm-thickness carbon fibre polymer composite laminates manufactured from unidirectional Hexcel M21/T800S pre-pregs. Peel-ply surface treatment was used for all joints. The bonds were deteriorated via five methods: pre-curing the centre of bond area prior to the cure of the bond edges, increasing the curing temperature rate, reducing the curing time, and embedding PTFE films over the centre of the bond. For the last method, the studies were carried out by embedding PTFE films on one and two sides of the adhesive film. The bond deterioration was followed by non-destructive inspections using ultrasound C-scanning. The ultimate failure load of the joints with defected bonds (i.e. weak and kissing bonds) was measured and compared to that of the joints with no defect (i.e. good bonds). It was found that rapid curing and short-time curing reduces more than 50% of the load carrying capacity of the single-lap joins in tension while the joints with weak bonds introduced by pre-curing of a large area of the bond (>60%) can take up more than 65% of the ultimate load of the joint with good bond. Also, optical microscopy of the bond surfaces after failure showed changes in failure type for the rapid and short-time cure, strongly correlated with their significant failure load reduction.
机译:本文研究了粘合的复合物与复合单圈接头在弱和接吻键存在下的准静态拉伸响应,作为在聚合物复合粘合修复中发生的粘合缺陷的表征的尝试。 Cytec FM 94粘合膜(0.25mm标称厚度)用于所有接头键合两种2mm厚度的碳纤维聚合物复合层叠层,由单向曲线M21 / T800S预先预先制备。剥皮层表面处理用于所有关节。通过五种方法恶化,将粘合面积预固化在粘合边缘之前,增加固化温度,降低固化时间,并将PTFE薄膜嵌入粘合中心上。对于最后一种方法,通过将PTFE膜嵌入粘合剂膜的一侧和两侧的PTFE膜来进行研究。使用超声C扫描的非破坏性检查之后,粘合劣化。测量禁用粘合的关节的最终失效量(即弱和亲吻键),并与没有缺陷的关节(即良好债券)进行比较。发现快速固化和短时固化减少了单圈加入的载荷容量的大于50%的载荷,而具有通过预固化债券的大面积(> 60)引入弱键的接头(> 60 %)可以占据良好粘合的关节最终负荷的65%以上。此外,在发生故障后的粘合表面的光学显微镜显示出的快速和短时固化的失效类型的变化,与其显着的故障负荷减少强烈相关。

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