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Optimization of PBGA encapsulation considering fluid/structure interaction using response surface methodology

机译：考虑响应面方法的流体/结构相互作用的PBGA封装优化

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This paper presents the optimization of the Plastic Ball Grid Array (PBGA) package during the encapsulation process. Optimized design of the PBGA package enhances the encapsulation process and minimizes the stress and deformation on the wires. The physical and process parameters (i.e., pressure inlet, diameter of wire, vent height, and mould filled time) were optimized via response surface methodology using central composite design (CCD) to minimize the stress of wire, wire sweep, filling time and void in package during the encapsulation process. The optimization of the PBGA encapsulation was carried out by considering the fluid/structure interaction (FSI) aspects. The optimum empirical models were examined and well confirmed with the simulation results. The optimum design of the PBGA package (30 mm × 30 mm) for both physical and process parameters was characterized by 8 wire bonds, 0.25 mm of vent thickness, 4.46 s of filling time and 2.52 % of void at the inlet condition of 10 MPa.
机译：本文在封装过程中呈现了塑料球栅阵列（PBGA）包装的优化。 PBGA封装的优化设计增强了封装过程，并最大限度地减少了线上的应力和变形。通过使用中央复合设计（CCD）通过响应面方法进行优化物理和工艺参数（即压力入口，导线，通风口高度和模具填充时间），以最大限度地减少电线，扫描，填充时间和空隙的应力在封装过程中的包装中。通过考虑流体/结构相互作用（FSI）方面来进行PBGA封装的优化。检查了最佳的经验模型，并通过模拟结果确认得很好。用于物理和工艺参数的PBGA封装（30mm×30mm）的最佳设计表征为8个线键，0.25mm的排气厚度，4.46秒，填充时间的2.​​52％，进样口状况为10 MPa 。

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