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首页> 外文会议>National Conference on Physics and Chemistry of Materials >Structure, Morphology and Electrical Behaviors of Polymer (Polystyrene)-Metal (Copper) Composite Thin Films
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Structure, Morphology and Electrical Behaviors of Polymer (Polystyrene)-Metal (Copper) Composite Thin Films

机译：聚合物（聚苯乙烯） - 复合薄膜（聚苯乙烯）复合薄膜的结构，形态和电能

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Metal-polymer composite filmsare prepared by depositing copper over the polystyrene films. DC magnetron sputtering is used to deposit copper, whereas spin coating method is used to prepare polystyrene layer on glass substrate. The crystallinity of the composite samples is studied using X-ray diffraction (XRD) method. Surface morphologies of the composite filmsareobtained from Atomic Force Microscopy (AFM), while the optical absorption behaviors are analyzed using UV-Vis spectroscopy. The electrical behaviors of these composite films are measured as a function of the deposition time of the sputtered copper layer over the polystyrene films. Results obtained from the XRD, AFM and UV-Vis spectroscopy provide the evidence of copper nanocrystals formationand from the electrical measurements, it is observed that the conductance of the composite film increases with the increase of the amount of copper nanoparticles inside the composite films.
机译：通过在聚苯乙烯薄膜上沉积铜制备的金属聚合物复合胶片。 DC磁控溅射用于沉积铜，而旋涂法用于在玻璃基板上制备聚苯乙烯层。使用X射线衍射（XRD）方法研究复合样品的结晶度。从原子力显微镜（AFM）的复合膜的表面形态，而使用UV-Vis光谱分析光学吸收行为。这些复合膜的电行为作为溅射铜层在聚苯乙烯薄膜上的沉积时间的函数测量。从XRD，AFM和UV-VIS光谱获得的结果提供了从电测量中形成的铜纳米晶体的证据，观察到复合膜的电导随复合膜内的铜纳米粒子量的增加而增加。

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