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BULGE TEST INVESTIGATION OF THE INFLUENCE OF MOISTURE ON MECHANICAL PROPERTIES OF THIN POLYMER LAYERS

机译:水分对薄聚合物层力学性能影响的膨胀试验研究

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Thin polymer layers gain importance as interlevel dielectrics in microelectronic devices. One major drawback of this class of material is instability of mechanical properties under changing climatic condition. The paper deals with evaluation of the bulge test as complementary method for investigation of humidity induced alterations of mechanical properties. It describes measurement of intrinsic as well as humidity induced stress in polymer layers. The given results agree very well with those obtained by substrate bending. Furthermore, bulge testing proved the assumption of earlier work, that change of mechanical stress is due to a humidity induced swelling process that can be described phenomenologically by expansion coefficient and a biaxial Young's modulus independent from relative humidity. Results are given and discussed for two types of polyimide.
机译:薄的聚合物层作为微电子器件中的间隙电介质获得重要性。 这类材料的一个主要缺点是在变化的气候条件下的机械性能的不稳定。 本文涉及对隆起试验的评价作为湿度诱导力学性能改变的互补方法。 它描述了在聚合物层中的内在和湿度诱导应力的测量。 给定的结果与衬底弯曲获得的结果非常好。 此外,凸起测试证明了较早工作的假设,机械应力的变化是由于湿度诱导的膨胀过程,可以通过膨胀系数和独立于相对湿度的双轴杨氏模量来描述。 给出并讨论了两种类型的聚酰亚胺。

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