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BULGE TEST INVESTIGATION OF THE INFLUENCE OF MOISTURE ON MECHANICAL PROPERTIES OF THIN POLYMER LAYERS

机译:水分对薄聚合物层力学性能影响的膨胀试验研究

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Thin polymer layers gain importance as interlevel dielectrics in microelectronic devices. One major drawback of this class of material is instability of mechanical properties under changing climatic condition. The paper deals with evaluation of the bulge test as complementary method for investigation of humidity induced alterations of mechanical properties. It describes measurement of intrinsic as well as humidity induced stress in polymer layers. The given results agree very well with those obtained by substrate bending. Furthermore, bulge testing proved the assumption of earlier work, that change of mechanical stress is due to a humidity induced swelling process that can be described phenomenologically by expansion coefficient and a biaxial Young's modulus independent from relative humidity. Results are given and discussed for two types of polyimide.
机译:薄的聚合物层作为微电子设备中的层间电介质变得越来越重要。这类材料的一个主要缺点是在不断变化的气候条件下机械性能的不稳定性。本文研究了凸起测试的评估,作为研究湿度引起的机械性能变化的补充方法。它描述了聚合物层中固有应力和湿度引起的应力的测量。给出的结果与通过基板弯曲获得的结果非常吻合。此外,膨胀测试证明了较早工作的假设,即机械应力的变化是由湿度引起的膨胀过程引起的,该现象在现象学上可以通过膨胀系数和独立于相对湿度的双轴杨氏模量来描述。给出并讨论了两种聚酰亚胺的结果。

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