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Development of Screen-Printed Impedance Sensor and Detections of Wiring Corrosion and Dew Condensation

机译:开发丝网印刷阻抗传感器和接线腐蚀和露水凝结的检测

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The pitch of wiring on printed circuit boards has become finer for the development of small and lightweight electronic devices. Due to the finer pitch of wire, dew condensation causes a short circuit of wiring easier and there is a risk of breaking the wiring due to slight corrosion. It is crucial to develop a sensor for monitoring dew condensation and corrosion of wiring in order to prevent these corrosion phenomena. Our group has developed a corrosion monitoring sensor with screen printing techniques. This sensor, which has a comb-like structure of silver wiring on the boards, can monitor dew condensation environments using electrochemical impedance spectroscopy (EIS) because of the change of impedance spectra with condensation condition. Aiba et al. have fabricated printed -type corrosion monitoring sensor which can evaluate amount of dew condensation. This sensor, which has wiring of a reference resistance by coating anticorrosion, can quantitatively evaluate dew condensation by standardizing the output impedance from the sensor with reference resistance. In this study, monitoring corrosion sensor that can accurately detect corrosion of wiring and dew condensation was developed using screen printing.
机译:印刷电路板上的接线间距变得更加细化,用于开发小巧轻便的电子设备。由于导线的更精细,露水冷凝导致布线短路更容易,并且由于轻微腐蚀而导致布线破坏的风险。开发一种用于监测露水冷凝和布线腐蚀的传感器至关重要,以防止这些腐蚀现象。我们的小组开发了一种带丝网印刷技术的腐蚀监测传感器。该传感器具有在电路板上的银色布线的梳状结构,可以使用电化学阻抗光谱(EIS)监测露水冷凝环境,因为具有冷凝条件的阻抗光谱的变化。 Aiba等人。已经制造了印刷型腐蚀监测传感器,可以评估露水凝结的量。通过涂层防腐具有参考电阻的接线的该传感器可以通过标准化来自传感器的输出阻抗来定量评估露水凝结。在本研究中,使用丝网印刷产生能够精确地检测布线和露凝块腐蚀的腐蚀传感器。

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