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首页> 外文会议>Conference on Metrology, Inspection, and Process Control for Microlithography >3D Isolated and Periodic Grooves Measurement Simulations for the Semiconductor Circuits by Scatterometry Using the FDTD Methods and the Time Shortening Calculation Method
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3D Isolated and Periodic Grooves Measurement Simulations for the Semiconductor Circuits by Scatterometry Using the FDTD Methods and the Time Shortening Calculation Method

机译：使用FDTD方法和时间缩短计算方法，3D隔离和周期凹槽通过散射测量来测量模拟半导体电路

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摘要

First, we establish numerical calculation techniques for the three-dimensional arbitrary cross section measurement equipment production using oblique incident light waves. In the 3D analysis, the enormous calculation times are problematic to analyze arbitrary cross sections using the FDTD (Finite Difference Time Domain) methods. Then, the sub-grids are used for the time shortening analysis. The sub-grid methods are carried out by the adoption to change the cell dimensions in some specific regions. The multilayer thin film parts are necessary to use the small lattice because we had to deal with the small shape changes. Second, the Gaussian beam incidence analysis for non periodic and isolated grooves is examined. The spot beams are needed for the analysis of the 3D isolation grooves. The scattering characteristics are examined using the spot size of 0.2-1.0 microns. Third, the cell size in the FDTD method must be small enough ( < a tenth of wavelength) and the time-step size must satisfy the Courant stability condition. The alternating-direction-implicit (ADI) time-stepping algorithm is introduced to address this issue. This method is unconditionally stable and the Courant stability condition can be eliminated.
机译：首先，我们使用斜入射光建立三维任意横截面测量设备生产的数值计算技术。在3D分析中，使用FDTD（有限差差时域）方法分析任意横截面是有问题的。然后，子网格用于时间缩短分析。通过采用来执行子网格方法以改变一些特定区域中的细胞尺寸。多层薄膜部件是使用小格子所必需的，因为我们必须处理小形状的变化。其次，检查了非周索和隔离凹槽的高斯光束发生率分析。用于分析3D隔离槽所需的点光束。使用0.2-1.0微米的光斑尺寸检查散射特性。第三，FDTD方法中的单元尺寸必须足够小（<第十波长），时间步长必须满足龙骨稳定条件。介绍了交替方向隐式（ADI）时间阶梯算法以解决这个问题。该方法无条件稳定，可以消除龙头稳定性条件。

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