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首页> 外文会议>Metrology, Inspection, and Process Control for Microlithography XX pt.2 >3D Isolated and Periodic Grooves Measurement Simulations for the Semiconductor Circuits by Scatterometry Using the FDTD Methods and the Time Shortening Calculation Method
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3D Isolated and Periodic Grooves Measurement Simulations for the Semiconductor Circuits by Scatterometry Using the FDTD Methods and the Time Shortening Calculation Method

机译：使用FDTD方法和时间缩短计算方法通过散射法对半导体电路进行3D隔离和周期性沟槽测量的仿真

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摘要

First, we establish numerical calculation techniques for the three-dimensional arbitrary cross section measurement equipment production using oblique incident light waves. In the 3D analysis, the enormous calculation times are problematic to analyze arbitrary cross sections using the FDTD (Finite Difference Time Domain) methods. Then, the sub-grids are used for the time shortening analysis. The sub-grid methods are carried out by the adoption to change the cell dimensions in some specific regions. The multilayer thin film parts are necessary to use the small lattice because we had to deal with the small shape changes. Second, the Gaussian beam incidence analysis for non periodic and isolated grooves is examined. The spot beams are needed for the analysis of the 3D isolation grooves. The scattering characteristics are examined using the spot size of 0.2-1.0 microns. Third, the cell size in the FDTD method must be small enough ( < a tenth of wavelength) and the time-step size must satisfy the Courant stability condition. The alternating-direction-implicit (ADI) time-stepping algorithm is introduced to address this issue. This method is unconditionally stable and the Courant stability condition can be eliminated.
机译：首先，我们建立了利用斜入射光波生产三维任意截面测量设备的数值计算技术。在3D分析中，使用FDTD（有限差分时域）方法分析任意横截面会产生巨大的计算时间。然后，将子网格用于时间缩短分析。通过采用子网格方法来更改某些特定区域中的单元格尺寸。多层薄膜部件是使用小格子所必需的，因为我们必须处理小的形状变化。其次，检查了非周期性和孤立沟槽的高斯光束入射分析。点光束是分析3D隔离槽所必需的。使用0.2-1.0微米的光点尺寸检查散射特性。第三，FDTD方法中的像元大小必须足够小（小于波长的十分之一），并且时间步长必须满足Courant稳定性条件。引入了交替方向隐式（ADI）时间步长算法来解决此问题。此方法是无条件稳定的，并且可以消除Courant稳定条件。

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