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Cross-Section Features Influence on Surrounding MuGFETs

机译:横截面特征影响周围的mugfet

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Based on the objective of keeping the MOS technology evolution, alternative technologies have been studied and some of them have presented quite interesting results, such as the Silicon-on-Insulator (SOI) one. Characterized by the presence of an insulator layer between the silicon substrate and the transistor active region, SOI devices were initially used mainly in harsh environments, in which low sensitivity to temperature variation (1,2) and high hardness against transient radiation effects are required (3), and have been increasingly used during the last decade for general purpose applications. In spite of the SOI transistors longer life duration, the issue of the charges control in the channel region is still considered a problem for shorter devices. In order to keep the continuous decrease in the MOS transistors dimensions, the academic community is studying the applicability of a multiple gate structure. The multiple gate architecture has presented a better behavior when compared to the single gate one (4,5). Among many observed advantages, it is possible to mention an increase in the transconductance, a better short channel effect and an almost ideal subthreshold slope.
机译:基于保持MOS技术演变的目的,已经研究了替代技术,其中一些技术呈现出相当有趣的结果,例如绝缘体(SOI)一个。其特征在于,在硅衬底和晶体管有源区之间存在绝缘层,SOI器件最初主要用于恶劣环境,其中需要对温度变化(1,2)和对瞬态辐射效应的高硬度进行低灵敏度( 3),并且在过去十年中越来越多地用于通用应用。尽管SOI晶体管更长的寿命持续时间,但频道区域中的电荷控制的问题仍然被认为是较短设备的问题。为了保持MOS晶体管尺寸的连续降低,学术界正在研究多栅极结构的适用性。与单门(4,5)相比,多个门架构呈现更好的行为。在许多观察到的优点中,可以提高跨导的增加,更好的短沟道效应和几乎理想的亚阈值斜率。

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