Molecular dynamic simulations of contact thermal resistance between two individual silicon nanowires

著录项

• 来源
  《International Conference of Chinese Society of Micro-Nano Technology;Annual Conference of the Chinese Society of Micro-Nano Technology》|2010年|p.663-667|共5页
• 会议地点 Xian(CN);Xian(CN)
• 作者

  Jianqiang Wang; Kedong Bi; Yunfei Chen;

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• 作者单位

  School of Mechanical Engineering, Southeast University, Nanjing, Jiangsu, P. R. C,Jiangsu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, Southeast University, Nanjing, Jiangsu, P. R. C;

  School of Mechanical Engineering, Southeast University, Nanjing, Jiangsu, P. R. C,Jiangsu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, Southeast University, Nanjing, Jiangsu, P. R. C;

  School of Mechanical Engineering, Southeast University, Nanjing, Jiangsu, P. R. C,Jiangsu Key Laboratory for Design and Manufacture of Micro-Nano Biomedical Instruments, Southeast University, Nanjing, Jiangsu, P. R. C,MEMS Key Laboratory of China Educational Ministry, Southeast University, Nanjing, Jiangsu,P.R.C;

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• 会议组织
• 原文格式 PDF
• 正文语种 eng
• 中图分类 光学仪器;微电子学、集成电路（IC）;
• 关键词

  contact thermal resistance; silicon nanowire; molecular dynamics; bonding strength;

  机译：接触热阻硅纳米线分子动力学粘接强度;