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首页> 外文会议>Metrology, Inspection, and Process Control for Microlithography XX pt.2 >Advanced CDSEM matching methodology for OPC litho cell based matching verification
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Advanced CDSEM matching methodology for OPC litho cell based matching verification

机译：先进的CDSEM匹配方法用于基于OPC光刻细胞的匹配验证

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摘要

Lithography in the low k_1 factor regime poses increasingly stringent requirements on the control of critical dimension (CD) of various pitch ratios, also referred to as the OPC (Optical Proximity Correction) curve. Part of the CD budget is consumed by the tool-to-tool variation of the CD metrology tools. Hence, a CD-SEM installed base must be matched for a wide range of pitches within 20% of the OPC litho cell budget. For the 70nm node the matching requirement is 1 nm (20% of 5 nm). Traditionally, scanning electron microscope (SEM) matching consisted of comparing multiple measurements of identical features from different SEMs. The differences found were applied as offsets in the SEMs. These offsets had to be determined for all features. For OPC applications, these features cover a large range of pitches. A full update of the offsets could take a couple of days. An advanced matching methodology has been applied, based upon component wise matching of the SEMs, without the use of matching offsets. This new approach allows to shorten the matching cycle time to a few hours only. A sensitive verification test, using an interlaced sampling scheme on resist layers, proved that better than 0.6nm across pitch matching can be achieved. This matching difference is low enough for successful OPC matching using multiple SEMs from an installed base and is on par with the ITRS and the industry requirement for the 45 nm technology node.
机译：在低k_1因子范围内的光刻技术对各种螺距比的临界尺寸（CD）的控制提出了越来越严格的要求，这也称为OPC（光学邻近校正）曲线。 CD预算工具的一部分是工具到工具的变体，消耗了一部分CD预算。因此，必须将CD-SEM的安装基座与OPC光刻单元预算的20％之内的各种间距相匹配。对于70纳米节点，匹配要求为1纳米（5纳米的20％）。传统上，扫描电子显微镜（SEM）匹配包括比较来自不同SEM的相同特征的多次测量。发现的差异被用作SEM中的偏移量。必须为所有功能确定这些偏移量。对于OPC应用，这些功能涵盖了大范围的音高。补偿的完整更新可能需要几天时间。在不使用匹配偏移的情况下，基于SEM的逐项匹配已应用了高级匹配方法。这种新方法可以将匹配周期时间缩短到仅几个小时。通过在抗蚀剂层上使用隔行采样方案进行的敏感验证测试，证明可以实现优于0.6nm的间距匹配。对于使用已安装的多个SEM进行成功的OPC匹配，此匹配差异足够小，并且与ITRS和45 nm技术节点的行业要求相当。

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