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首页> 外文会议>Microelectronics Technology and Devices-SBMicro 2008 >Study of a Low Cost Reballing of BGA Method with Lead-Free Solder Paste
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Study of a Low Cost Reballing of BGA Method with Lead-Free Solder Paste

机译：无铅锡膏BGA方法的低成本植球研究

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摘要

Due to environmental consciousness and legislative regulations, lead-free solders have been replaced most of the conventional lead-containing solders in microelectronic industry, Ih response to the concern over Pb used in electronic products and manufacturing electronics, much work is ongoing to find new parameters for re-balling process. This paper describes a low cost reballing method with lead free solder paste on BGA (Ball Grid Array) packages. It was used a lead free solder paste with composition Sn 96,5%, Ag 3,0% and Cu 0,5% and the reflow technology. The results obtained were compared with the conventional reballing method. The solder properties such as wetting characteristics as well as the amount of solder paste deposited by dspenser onto the substrate bond pads influenced on the formation of the bumps. By controlling the volume of solder paste deposited and the parameters used during the reflow step it was possible to obtain bumps liked semi spherical format that can be used to replace the solder balls on the conventional rework of BGA.
机译：由于环保意识和法律法规的限制，无铅焊料已被微电子行业中的大多数常规含铅焊料所取代。为了回应人们对电子产品和制造电子产品中所用铅的关注，正在努力寻找新的参数重新球化过程。本文介绍了一种在BGA（球栅阵列）封装上使用无铅焊膏的低成本植球方法。它使用了组成为Sn 96.5％，Ag 3.0％和Cu 0.5％的无铅焊膏以及回流技术。将获得的结果与常规植球法进行比较。焊料特性（如润湿特性）以及由dspenser沉积到基板焊盘上的焊膏量会影响凸点的形成。通过控制沉积的焊膏量和在回流步骤中使用的参数，可以获得类似于半球形形式的凸块，该凸块可用于替代BGA的传统返工焊球。

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  • 来源
  • 会议地点 Gramado(BR);Gramado(BR);Gramado(BR);Gramado(BR);Gramado(BR);Gramado(BR)
  • 作者

    T. Mazon; G. E. Prevedel; E A. Schenkel; M. T. Biasoli;

  • 作者单位

    Divisao de Empacotamento Eletronico, Centro de Pesquisas Renato Archer - CenPRA, Rod. D. Pedro I, Km 143,6, Campinas- SP, 13069-901, Brazil;

    Divisao de Empacotamento Eletronico, Centro de Pesquisas Renato Archer - CenPRA, Rod. D. Pedro I, Km 143,6, Campinas- SP, 13069-901, Brazil;

    Divisao de Empacotamento Eletronico, Centro de Pesquisas Renato Archer - CenPRA, Rod. D. Pedro I, Km 143,6, Campinas- SP, 13069-901, Brazil;

    Divisao de Empacotamento Eletronico, Centro de Pesquisas Renato Archer - CenPRA, Rod. D. Pedro I, Km 143,6, Campinas- SP, 13069-901, Brazil;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 微电子学、集成电路（IC）;
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