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Fabrication of micro-chambers and enclosures using synchronous localized electro-deposition

机译：使用同步局部电沉积制造微室和外壳

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摘要

The presented work demonstrates that the ability of localized electro-deposition to fabricate truly three dimensional microstructures does not only require accurate control of the deposition electrode, but also demands a fabrication strategy that highly affects deposition resolution, characteristics, and the economical return of the technology. For this purpose, a synchronous deposition strategy is proposed utilizing two tip displacement algorithms. Both algorithms view three dimensional microstructures as stacks of lateral trajectories forming the structure's boundaries. In the first algorithm the synchronized tip positioning is implemented using tip stepped displacement, where the tip is moved from a point on a deposition trajectory to a neighboring location only upon sufficient deposition at the current location. The second algorithm, however, is implemented using continuous electrode displacement that allows deposition at all points along a trajectory while the tip is kept in continuous motion. The proposed synchronous deposition algorithms are demonstrated through the fabrication of micro-chambers and enclosures of arbitrary size and geometries. Comparison between both algorithms is concluded from SEM images of deposited structures in terms of deposit characteristics and strategy artifacts. The stepped displacement algorithm provides a shorter fabrication time but suffers from stepping artifacts. The continuous displacement algorithm, on the other hand, provides smooth boundaries but requires longer fabrication time that depends on the displacement speed of the deposition tip relative to the deposition growth rate.
机译：提出的工作表明，局部电沉积能够制造真正的三维微观结构的能力不仅需要对沉积电极的精确控制，而且还需要一种对沉积分辨率，特性和技术的经济回报有重大影响的制造策略。 。为此，提出了一种利用两个尖端位移算法的同步沉积策略。两种算法都将三维微观结构视为形成结构边界的横向轨迹堆栈。在第一种算法中，同步的尖端定位是使用尖端步进位移实现的，只有在当前位置进行足够的沉积时，尖端才会从沉积轨迹上的点移动到相邻位置。但是，第二种算法是使用连续的电极位移实现的，该位移允许在尖端保持连续运动的同时沿轨迹的所有点进行沉积。通过制造微腔和任意大小和几何形状的外壳，可以证明所提出的同步沉积算法。两种算法之间的比较是根据沉积结构的SEM图像得出的沉积特征和策略伪像得出的。阶梯位移算法提供了较短的制造时间，但存在阶梯伪影。另一方面，连续位移算法提供了平滑的边界，但是需要更长的制造时间，这取决于沉积尖端相对于沉积生长速率的位移速度。

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