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Enabling technologies for microsystems-based nanosatellites

机译：基于微系统的纳米卫星的使能技术

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?AC Microtec (?AC) has developed a 3D-System-in-Package (3D-SiP) technology based on 3D-waferrnlevel packaging (3D-WLP) methodology which offers extreme endurance to vibrations, and large temperaturernranges. The technology enables wafer level packaging and the use of several different substrates, including lowrntemperature co-fired ceramics(LTCC), high temperature co-fired ceramics (HTCC), and silicon. An importantrndevelopment for power electronics and system packaging is ?AC's newly qualified and patented metallicrnthrough silicon via (TSV) technology, XiVIA?rn, compatible with today’s micro-electro-mechanical-systemsrn(MEMS) foundries and especially interposer applications on wafer thickness between 100-800 μm.rnThree different types of miniaturized spacecraft systems have been designed, built and verified. A corerncomponent for Plug and Play enabled spacecraft architectures, Remote Terminal Unit (RTU), an equivalent ofrnthe U.S. Plug and Play (PnP) Appliqué Sensor Interface (ASIM). Second, an H-bridge addition module (MACS)rnthat connects to the RTU featuring three full H-bridges for satellite magnetic attitude control.rnThird, a miniaturized 10 Gbit solid state mass memory (SSMM) bank developed together with RUAGrnAerospace (formerly Saab Space).rn?AC Microtec has delivered these module in a distributed configuration architecture called INOVATORrnto the OHB System provided in-space flight validation platform RUBINconfiguration9.2 planned to be launchedrnin the second half of 2009.
机译：？AC Microtec（？AC）开发了一种基于3D晶圆级封装（3D-WLP）方法的3D封装系统（3D-SiP）技术，该技术可极大地抵抗振动和较大的温度范围。该技术使晶圆级封装和多种不同衬底的使用成为可能，包括低温共烧陶瓷（LTCC），高温共烧陶瓷（HTCC）和硅。电力电子和系统封装的一项重要发展是？AC的最新合格且获得专利的金属通孔硅（TSV）技术XiVIA®，可与当今的微电子机械系统（MEMS）铸造厂兼容，尤其适用于晶圆厚度在100到100之间的中介层应用-800μm.rn已经设计，建造和验证了三种不同类型的小型航天器系统。远程即插即用（RTU）是启用即插即用的航天器体系结构的核心组件，等效于美国即插即用（PnP）应用传感器接口（ASIM）。其次，连接到RTU的H桥附加模块（MACS）rn具有三个用于卫星磁姿态控制的完整H桥.rn第三，与RUAGrn一起开发的小型10 Gbit固态海量存储器（SSMM）库AC Microtec已将这些模块以称为INOVATORrn的分布式配置架构交付给OHB系统，该计划提供了计划于2009年下半年启动的太空飞行验证平台RUBINconfiguration9.2。

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