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Stress Effects on the Properties of Copper Layer Employed in the Multi-level Interconnection

机译:应力对多层互连中铜层性能的影响

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摘要

This paper describes the effect of the stress and grain size in the seed layer on the properties copper interconnection layer, such as resistivity and grain size. Effect of the chemicals employing for the electroplating of copper layer is also studied after deposited on these seed layers. Lower resistivity copper layer can be obtained with reducing of the stress and with growing of grain in the seed and interconnection layers.
机译:本文描述了种子层中的应力和晶粒尺寸对铜互连层特性(如电阻率和晶粒尺寸)的影响。在沉积到这些种子层上之后,还研究了用于电镀铜层的化学药品的效果。在降低应力并在籽晶层和互连层中晶粒增长的同时,可以获得较低电阻率的铜层。

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