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Single Crystal Gallium Nitride on Silicon Using SiC as an Intermediate Layer

机译:使用SiC作为中间层的硅单晶氮化镓

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摘要

GaN films have been grown atop SiC intermediate layers on Si(001) and Si(111) substrates using supersonic jet epitaxy (SJE). GaN growth temperatures ranged between 600℃ and 775 ℃. Methylsilane (H_3SiCH_3) was used as the single source precursor for SiC growth and triethylgallium (TEG) and ammonia (NH_3) were the sources for GaN epitaxy. The GaN growth rate was found to depend strongly on substrate orientation, growth temperature, and flux. Structural characterization of the films was done by transmission electron diffraction (TED) and x-ray diffraction (XRD). Growth of GaN on SiC(002) produces a cubic or mixed phase of cubic and wurtzite depending on growth conditions. Growth on SiC(111) produces predominantly wurtzite GaN(0002). Minimum rocking curve widths for GaN(0002) on SiC/Si(111) and GaN(002) on SiC/Si(001) are 0.6° and 1.5°, respectively. Cross Sectional Transmission Electron Microscopy (XTEM) was also performed.
机译:GaN膜已使用超音速喷射外延(SJE)在Si(001)和Si(111)衬底上的SiC中间层上方生长。 GaN的生长温度在600℃至775℃之间。甲基硅烷(H_3SiCH_3)被用作SiC生长的单一来源前体,三乙基镓(TEG)和氨(NH_3)是GaN外延的来源。发现GaN的生长速率强烈依赖于衬底取向,生长温度和通量。薄膜的结构表征是通过透射电子衍射(TED)和X射线衍射(XRD)进行的。取决于生长条件,在SiC(002)上生长GaN会生成立方晶或纤锌矿的立方相或混合相。在SiC(111)上生长主要产生纤锌矿GaN(0002)。 SiC / Si(111)上的GaN(0002)和SiC / Si(001)上的GaN(002)的最小摇摆曲线宽度分别为0.6°和1.5°。还进行了截面透射电子显微镜(XTEM)。

著录项

  • 来源
    《Nitride semiconductors》|1997年|313-318|共6页
  • 会议地点 Boston MA(US)
  • 作者

    S.A. USTIN; W. HO;

  • 作者单位

    Department of Physics, Cornell University, Ithaca, N.Y., 14853;

    Department of Physics, Cornell University, Ithaca, N.Y., 14853;

  • 会议组织
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类 材料;
  • 关键词

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