首页> 外文会议>Optoelectronic Interconnects XII. >Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on Si

【24h】

Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on Si

机译：基于Si上光电管芯3D堆叠的芯片间互连

获取原文

获取原文并翻译 | 示例

页面导航

摘要
著录项
相似文献
相关主题

摘要

We demonstrate a new approach to increase the optical interconnection bandwidth density by stacking the opto-electrical dies directly on the CMOS driver. The suggested implementation is aiming to provide a wafer scale process which will make the use of wi

机译：我们演示了一种通过将光电管芯直接堆叠在CMOS驱动器上来增加光互连带宽密度的新方法。建议的实现旨在提供一种晶圆级工艺，该工艺将利用wi

著录项

来源
《Optoelectronic Interconnects XII.》|2012年|p.1-6|共6页
会议地点 San Francisco CA(US)
作者
P. Duan; O. Raz; B. E. Smalbrugge; H. J. S. Dorren;
展开▼
作者单位

Technische Univ. Eindhoven (Netherlands);

展开▼
会议组织
原文格式 PDF
正文语种 eng
中图分类光电子技术的应用;光电子技术的应用;
关键词

相似文献

外文文献
中文文献
专利

1. High-res 3D X-ray microscopy for non-destructive failure analysis of chip-to-chip micro-bump interconnects in stacked die packages [J] . Zulkifli Syahiran Md, Zee Bernice, Diu Wen, Solid state technology . 2018,第1期

机译：高分辨率3D X射线显微镜，用于堆叠式芯片封装中的芯片间微凸点互连的无损失效分析
2. 3D printed high density, reversible, chip-to-chip microfluidic interconnects [J] . Gong Hua, Woolley Adam T., Nordin Gregory P. Lab on a chip . 2018,第4期

机译：3D印刷高密度，可逆，芯片到片上的微流体互连
3. 3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing [J] . Le Fuliang, Lee Shi-Wei Ricky, Zhang Qiming Journal of Micromechanics and Microengineering . 2017,第4期

机译：3D堆叠与通过硅通孔（TSV）的芯片垂直互连和底部截止分配
4. High-Res 3D X-ray Microscopy for Non-Destructive Failure Analysis of Chip-to-Chip Micro-bump Interconnects in Stacked Die Packages [C] . Syahirah Md Zulkifli, Bernice Zee, Wen Qiu, International Symposium on the Physical and Failure Analysis of Integrated Circuits . 2017

机译：高分辨率3D X射线显微镜，用于堆叠模具包装中的芯片片微凸块互连的非破坏性故障分析
5. Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs. [D] . Noia, Brandon. 2014

机译：基于TSV的3D堆叠式IC的测试设计和测试优化技术。
6. 3D printed high density reversible chip-to-chip microfluidic interconnects [O] . Hua Gong, Adam T. Woolley, Gregory P. Nordin -1

机译：3D打印的高密度可逆的芯片到芯片微流体互连
7. High-Frequency Transmission Characteristics of the Interconnects Stacked into the 3D IC Configuration [O] . Yoichiro Kurita, Norikazu Motohashi, Satoshi Matsui, 2011

机译：堆叠到3D IC配置中的互连的高频传输特性
8. Heterogeneous 3D IC Stacking Using Ultra-Dense Mechanically Flexible Interconnects. [R] . Jo, P. K., Zia, M., Gonzalez, J. L., 2016

机译：使用超密集机械柔性互连的异构3D IC堆叠。

Chip-to-chip interconnects based on 3D stacking of optoelectrical dies on Si

摘要

著录项

相似文献

相关主题

期刊订阅