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Design of a highly parallel board-level-interconnection with 320 Gbps capacity

机译：具有320 Gbps容量的高度并行板级互连设计

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A parallel board-level interconnection design is presented consisting of 32 channels, each operating at 10 Gbps. The hardware uses available optoelectronic components (VCSEL, TIA, pin-diodes) and a combination of planarintegrated free-space optics, fiber-

机译：提出了一种并行的板级互连设计，该设计包含32个通道，每个通道以10 Gbps的速度运行。硬件使用可用的光电组件（VCSEL，TIA，引脚二极管）以及平面集成的自由空间光学器件，光纤，

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来源
《Optoelectronic Interconnects XII.》|2012年|p.1-6|共6页
会议地点 San Francisco CA(US)
作者
U. Lohmann; J. Jahns;
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作者单位

FernUniv. in Hagen (Germany);

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会议组织
原文格式 PDF
正文语种 eng
中图分类光电子技术的应用;光电子技术的应用;
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7. Design of a highly parallel board-level-interconnection with 320 Gbps capacity [O] . U. Lohmanna, J. Jahnsa, S. Limmerb, 2014

机译：设计具有320 Gbps容量的高度并行板级互连

Design of a highly parallel board-level-interconnection with 320 Gbps capacity

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