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Effects of Slurry Distribution using Diaphragm and Centrifugal pumps on the Defectivity in a Cu CMP Process

机译:隔膜泵和离心泵分配浆料对Cu CMP工艺中缺陷率的影响

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摘要

Slurry health has been shown to impact defectivity in the chemical mechanical planarization (CMP) process. Improper mechanical handling is known to form large agglomerates in CMP slurries that can lead to increased scratching of the surface. The foremost cause of slurry damage occurs from shear stresses placed on the slurry particles as they pass through the motive force in a distribution system.
机译:浆液健康状况已显示出会影响化学机械平面化(CMP)过程中的缺陷率。已知机械处理不当会在CMP浆料中形成大块,这会导致表面刮擦的加剧。浆液损坏的最主要原因是当浆液颗粒通过分配系统中的原动力时,施加在浆液颗粒上的剪切应力引起的。

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