首页> 外文会议>SEM IX International Congress on Experimental Mechanics June 5-8, 2000 Orlando, Florida >Different Profile Designs in Wirebond Uisng a Linkage-Spring Model
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Different Profile Designs in Wirebond Uisng a Linkage-Spring Model

机译:使用链接弹簧模型的引线键合中的不同轮廓设计

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Different profiles of a wirebond utilizing a linkage-spring model are proposed in this paper, and loop heights are minimized in order to prevent wire sweep during molding. To analyze loop profiles, a non-quantitative, time-consuming, experimental statistical method was applied in previous studies. The linkage-spring model is chosen for simplicity although the finite element model is the most powerfu tool in stress analysis. The purpose of this paper is to simulate the capillary trajectory from the first bond to the second bond stages by a linkage-spring model developed by Lo, and then to discover the proper wirebond trajectories. To meet with the gold wire properties, the transient temperature distribution along the gold wire during the bonding process is considered.
机译:本文提出了一种利用连接弹簧模型的引线键合的不同轮廓,并且为了防止模制过程中的导线扫掠,使环的高度最小化。为了分析回路轮廓,在先前的研究中采用了非定量,费时的实验统计方法。为简化起见,选择了连杆弹簧模型,尽管有限元模型是应力分析中功能最强大的工具。本文的目的是通过Lo开发的连接弹簧模型来模拟从第一键到第二键的毛细管运动轨迹,然后发现合适的引线键合轨迹。为了满足金线的特性,考虑了键合过程中沿金线的瞬态温度分布。

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